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ATP Industrial Grade CompactFlash SLC Extended Temperature

Reliable Performance in Any Environment
Ruggedized flash products designed to perform consistently under conditions of extreme temperature, shock, vibration, and humidity.

Introducing ATP Industrial Grade CF Cards, the world's most reliable CompactFlash Cards optimized for demanding industrial applications such as military, automotive, marine navigation, aviation, where mission-critical data requires the highest level of reliability, durability, and data integrity.

ATP's SIP (System-In-Packaging) manufacturing process encapsulates all exposed components and points of failure to ensure the products are fully waterproof, shockproof, and ESD (Electro-Static Discharge) proof. ATP Industrial Grade CF Cards can withstand at least a storage temperature range of -40 to 85 degrees Celsius and an operating temperature range of -40 to 85 degrees Celsius.

In addition to this temperature range, the cards are completely waterproof, dustproof, and ESD (Electro-Static Discharge) proof. All ATP Industrial Grade CF cards are produced under a stringent RoHs and Green Package compliant manufacturing process to guarantee a consistent high level of build quality and performance.

Fixed Disk/True IDE Compatibility
ATP Industrial Grade CF cards allow for full Fixed Disk/True IDE compatibility, including interface modes PIO up to mode 6, MW-DMA up to mode 4, and UDMA up to mode 5. This mode allows for seamless integration of CF cards as bootable solid state storage.

High Speed
ATP Industrial Grade flash cards deliver outstanding performance with data transfer speeds up to 45MB/sec while ATP Industrial Grade SSDs offer data transfer rates at up to 100MB/sec.

Highly Reliable
All ATP Industrial Grade CF, SD, USB drives, and SSDs are constructed using best-in-class SLC(Single-Level Cell) components with enhanced Error Correction Code(ECC) functions and wear leveling algorithms. This results in MTBF ratings over 2 million hours and the highest write cycle lifetimes in the industry. ATP's SIP (System-In-Packaging) manufacturing process encapsulates all exposed components and points of failure to ensure the products are fully waterproof, shockproof, and ESD (Electro-Static Discharge) proof.

Full Manufacturer Support and Product Consistency
Being a true manufacturer gives ATP the ability to support customers with a fixed BOM policy, ensuring both consistent compatibility and performance. ATP also fully supports its customers with product customization and tuning to optimize performance in particular or specialized applications.

Key Features